Wafer Mapping Sensor EX-Q & EX-QS FAQ
CyberOptics Semiconductor provides the answers to the most commonly asked questions about wafer mapping sensors.
We are constantly adding questions and answers to our product FAQ section. If you don't find your product question/answer, please contact us.
Sensor Performance
- What improvements have been made to the EX-Q sensor over previous CyberOptics Semiconductor and HAMA sensors?
- I want fail-safe wafer detection. Do I need to switch to a through-beam wafer mapping solution to achieve this type of performance?
- Are there advantages to using EX-Q sensors versus through-beam?
Legacy Products (DRM, DD, WX and ZX sensors)
- I have an old HAMA sensor. Does CyberOptics Semiconductor support these old wafer mapping sensors?
- Will existing older HAMA DRM, DD and WX models of wafer mapping sensors continue to work in process tools?
- I am currently using an older DRM, DD or ZX sensor. Can I still buy these sensors?
- What is involved in upgrading from a legacy model of HAMA sensor, such as the DD or WX, to an EX-Q Series wafer mapping sensor?
Safety
- Is the laser-based EX-Q sensor safe or will special precautions need to be taken by tool operators?
- Do CyberOptics Semiconductor wafer mapping sensors conform to FDA and CDRH laser safety standards?
Application / Setup
- Are different configurations and/or setups required depending on the type of wafer being mapped?
- Will the EX-Q work with any size wafer?
- Is the EX-Q limited to one scan distance or scan angle?
- I used the alignment card to properly align my CyberOptics Semiconductor wafer mapping sensor and now I seem to have more problems with mapping than before. What is going on?
Sensor Performance
What improvements have been made to the EX-Q sensor over previous CyberOptics Semiconductor and HAMA sensors?
- The laser stripe of the EX-Q was reduced to 0.05 mm. This enables the EX-Q to provide consistent detection performance (apparent wafer thickness) that is less dependent on wafer characteristics (coating, edge geometry, thickness, etc.) – similar to through-beam performance.
- A 3° vertical tilt has been incorporated into the laser and detector optics of the EX-Q to avoid FOUP back reflections. This results in significantly reduced susceptibility to stray reflections.
I want fail-safe wafer detection. Do I need to switch to a through-beam wafer mapping solution to achieve this type of performance?
No. The EX-Q wafer mapping sensor provides consistent and accurate performance, independent of wafer characteristics and it does not require gain adjustment. The EX-Q has a new laser optical design that reduced the laser stripe thickness. As a result EX-Q sensors report consistent and accurate apparent wafer thickness that is comparable to through-beam. Contact technical support if you would like to learn more about apparent wafer thickness and why it is important.
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Are there advantages to using EX-Q sensors versus through-beam?
Yes. EX-Q sensors provide the same consistent, robust detection of through-beam sensors, without requiring gain adjustments. However, EX-Q sensors also detect thin wafers that can "hide" in the beam of through-beam sensors and therefore can be missed. The EX-Q is a non-intrusive mapping solution with a range of standoff distance options that provide setup flexibility. The sensor contains no moving parts that can cause particulate contamination. The EX-Q is quick and easy to implement, eliminating the time-consuming design cycles that may be required for through-beam solutions. The same EX-Q sensor can also be used to detect wafers of all sizes and reflectivity, without requiring any change to the overall setup. EX-Q sensors provide setup flexibility working with both on- and off-axis scans.
Legacy Products (DRM, DD, WX and ZX sensors)
I have an old HAMA sensor. Does CyberOptics Semiconductor support these old wafer mapping sensors?
Yes. CyberOptics Corporation acquired HAMA Sensors (HAMA Laboratories, Inc.) in 1999. In 2002 CyberOptics Semiconductor was formally incorporated. CyberOptics Semiconductor has continued to develop wafer mapping sensors, including the new EX-Q wafer mapping sensor, and also technical support for old HAMA model sensors.
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Will existing older HAMA DRM, DD and WX models of wafer mapping sensors continue to work in process tools?
From a functional standpoint, the older HAMA wafer mapping sensors will generally operate for years. A majority of the original HAMA sensor units placed in production in the 1990s are still in production today. However, from a performance standpoint, these wafer mapping sensors were not designed to detect dark and ultra-thin wafers that are commonly found in fabs today. Ultimately as these dark and thin wafers are introduced into process tools, the older sensors will need to be upgraded. EX-Q wafer mapping sensors are capable of detecting bright, dark and thin wafers.
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I am currently using an older DRM, DD or ZX sensor. Can I still buy these sensors?
The DRM, DD and ZX sensors have been replaced by the superior EX-Q wafer mapping sensor and are no longer available for purchase. Field upgrades to the EX-Q are easy. Depending on the model being replaced, there may be minor differences. Please contact technical support for specific upgrade details for your legacy HAMA sensor.
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What is involved in upgrading from a legacy model of HAMA sensor such as the DD or WX to an EX-Q Series wafer mapping sensor?
Upgrading from a legacy HAMA sensor to the EX-Q Series sensor is easy. EX-Q sensors have the same mechanical footprint, electrical interface and digital output as DD and WX sensors. It is only necessary to make minor parameter adjustments and reteach the robot. Please contact technical support if you have any questions regarding upgrading wafer mapping sensors.
Safety
Is the laser-based EX-Q sensor safe or will special precautions need to be taken by tool operators?
EX-Q sensors are Class 1 laser products. All of the sensors currently manufactured by CyberOptics Semiconductor are Class 1. Class 1 is the lowest power classification available from CDRH (the division of the FDA that has legal jurisdiction over laser devices in the U.S.). Class 1 laser devices are still regulated devices. However, the regulations are almost entirely concerned with labeling, document and reporting requirements.
There are no real restrictions on the use of Class 1 devices. As long as the devices and the equipment they contain are labeled, documented, and the relevant reports are sent to CDRH, no special precautions are needed. Safety goggles, screens, special training, use restrictions, key locks, and interlocks are not required. The duration of exposure to the laser is also not an issue since these particular sensors have a power low enough for continuous exposure.
Labeling, document and reporting requirements can be found at the CDRH website.
All sensors currently manufactured by CyberOptics Semiconductor comply with Class 1 of the European/international requirements (IEC 60825-1 (2001-08)) and with the laser safety requirements of SEMI S2-0200. The same regulatory comments apply to these.
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Do CyberOptics Semiconductor wafer mapping sensors conform to FDA and CDRH laser safety standards?
CyberOptics Semiconductor has all the necessary regulatory documentation required to sell lasers on file. Documentation is available upon request through technical support for customers who require laser safety reports or CDRH reports.
Application / Setup
Are different configurations and/or setups required depending on the type of wafer being mapped?
No. When presented with cassettes or FOUPs of wafers with different characteristics, EX-Q wafer mapping sensors do not require any setup or adjustment changes. The EX-Q will work for both on- and off-axis scans of 150 mm, 200 mm and 300 mm wafers.
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Will the EX-Q work with any size wafer?
Yes. The EX-Q can reliably detect 50 mm, 100 mm, 150 mm, 200 mm and 300 mm wafers.
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Is the EX-Q limited to one scan distance or scan angle?
No. The EX-Q is available in focal length distances of 1.5", 2.2", 3.0" and 4.5". Maximum detecting range varies by sensor stand-off. Refer to the EX-Q data sheet for more information.
Also, unlike a typical through-beam solution that can only scan wafers from a fixed position in front of the FOUP or cassette, the EX-Q sensor can accurately scan wafers from a number of different angles approaching the FOUP or cassette. For more information about the working angle range for a particular sensor, refer to the EX-Q data sheet or instructions.
I used the alignment card to properly align my CyberOptics Semiconductor wafer mapping sensor and now I seem to have more problems with mapping than before. What is going on?
Each mapping sensor model is designed to work within a specific standoff distance and working angle range. The alignment card is a handy tool and, when it is used during the robot setup and teach process, it will guarantee a mapping sensor is properly set up for maximum wafer detection response.
However, if after properly configuring a mapping sensor with the alignment card, wafer mapping errors seem to have increased, this may be a sign that another problem exists in the mapping system configuration. For example, the mapping algorithm may need adjustment or, if an older model sensor is being used (DD, WX, EX models), the old sensor may not be suited to the new mapping environment.
Upgrading to the EX-Q mapping sensor is an easy solution to this problem. If you suspect that aligning your mapping sensor with the alignment card has increased wafer mapping problems rather than decreased them, please contact technical support and we will help you troubleshoot the problem.
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